Horizontal Crack Induces Vertical Crack For-mation in Epoxy Mold Compound for Electronic Packaging

Syed Mohamad Mardzukey Syed Mohamed Zain, Azman Jalar, Maria Abu Bakar, Fakhrozi Che Ani, Mohamad Riduwan Ramli

Abstract


Epoxy mold compound (EMC) has been widely applied as the packaging material in the electronic industry. It is due to the unique property of EMC such as high temperature stability, low coefficient of thermal expansion (CTE), excellent electrical properties and manufacturability. Despite of superior properties of EMC, several failures have been reported regarding on the electronic packaging application such as crack on the body (EMC). Most of the research reported that the crack defect was originated from the moisture absorption.  This research is intended to examine the phenomenon and effect of moisture absorption on the vertical and horizontal crack formation. A comparison between control and conditioned sample was studied where the conditioned sample was subjected to humidity chamber according to the Moisture Sensitivity Level 3 (MSL3) requirement. Horizontal crack occurrence has been observed at the interface EMC. While vertical crack occurrence could be linked with the horizontal crack. Further analysis suggest that horizontal crack occurrence induced vertical crack occurrence. Thus, controlling moisture absorption pathway probably minimize horizontal crack and prohibit vertical crack occurrence.

Keywords


BGA component, Epoxy Mold Compound, Horizontal Crack, Moisture Crack, Moisture Sensitivity Level 3, Vertical Crack

Full Text:

PDF

References


S. K. Groothuis, K. G. Heinen and L. Rimpillo, "Ef-fects of mold compound material properties on solder reflow package cracking," Proceed. 1995 IEEE Int. Rel. Phy. Symp., pp. 76-84, 1995, https://doi: 10.1109/RELPHY.1995.513658.

Y. Chen and P. Li, "The “popcorn effect” of plastic encapsulated microelectronic devices and the typical cases study," Int. Conf. Qual. Rel. Risk Maint. Safety Eng., pp. 482-485, 2011, https://doi: 10.1109/ICQR2MSE.2011.5976658.

J. Lau, R. Chen and C. Chang, "Real-time popcorn analysis of plastic ball grid array packages during solder reflow," 23rd IEEE/CPMT Int. Elect. Manu-fac. Tech. Symp., (Cat. No.98CH36205), pp. 455-463, 1998, https://doi: 10.1109/IEMT.1998.731172.

N. Ismail, A. Jalar, M. Abu Bakar, N.S. Safee, W.Y Wan Yusoff,. and A. Ismail, "Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition," Solder. Surf. Mt. Tech., Vol. 33 No. 1, pp. 47-56, 2021, https://doi.org/10.1108/SSMT-11-2019-0035

M.S. Rusdi, M.Z. Abdullah, M.H.H. Ishak,. et al., “Three-dimensional CFD simulation of the stencil printing performance of solder paste,” Int J Adv Manuf Technol, vol .108, pp. 3351–3359, 2020, https://doi.org/10.1007/s00170-020-05636-9

A. Jalar, M.A. Bakar, & R. Ismail, “Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindenta-tion Approach,” Metall Mater Trans A, vol.51, pp. 1221–1228, 2020, https://doi.org/10.1007/s11661-019-05614-1

W.Y. Wan Yusoff, N. Ismail, N.S. Safee, A. Ismail, A. Jalar, and M. Abu Bakar, "Correlation of mi-crostructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free sol-der under blast wave condition," Solder Surf Mt Techn, Vol. 31 No. 2, pp. 102-108, 2020, https://doi.org/10.1108/SSMT-06-2018-0019

F. Che Ani, A. Jalar, A.A. Saad, C.Y. Khor, M.A. Abas, Z. Bachok, and N.K. Othman, "Character-ization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly", Solder Surf Mt Tech, Vol. 31 No. 2, pp. 109-124, 2019, https://doi.org/10.1108/SSMT-06-2018-0019

A. A. Gallo and R. Munamarty, "Popcorning: a fail-ure mechanism in plastic-encapsulated microcir-cuits," IEEE Trans Rel, vol. 44, no. 3, pp. 362-367, Sept. 1995, https://doi: 10.1109/24.406565. 10.1109/24.406565

W. L. Yang and D. M. S. Yin, "The effects of epoxy molding compound composition on the warpage and popcorn resistance of PBGA," Proceed 49th Elect Comp Tech Conf (Cat. No.99CH36299), pp. 721-726, 1999, https://doi: 10.1109/ECTC.1999.776261.

T. C. Chai, K. C. Chan, E. H. Wong, X. J. Fan and T. B. Lim, "Achieving crack free package through elimination of type II failure," Proceed 49th Elect Comp Tech Conf (Cat. No.99CH36299), pp. 702-707, 1999, https://doi: 10.1109/ECTC.1999.776256.

Iok-Tong Chong, D. C. C. Lam and Pin Tong, "Measurement of water evaporation rate from epoxy," Int Symp Elect Mater Packag (EMAP2000) (Cat. No.00EX458), pp. 440-443, 2000, https://doi: 10.1109/EMAP.2000.904196. 10.1109/EMAP.2000.904196.

R. Sheng, C. Chen, H. Chen and C. Wang, "A novel temporary adhesive for solder ball attachment in fluxless reflow system," 2017 12th Int Microsyst Packag Assemb Circuits Tech Conf (IMPACT), pp. 66-69, 2017, https://doi:10.1109/IMPACT.2017.8255943.

K. Abhishek, S. David, V.N.N. Trilochan Rambhatla, K.S. Suresh, “Effect of temperature and humidity conditioning on copper lead-frame/mold compound interfacial delamination,” Microelect Rel, Volume 111, pp.113647, 2020,

https://doi.org/10.1016/j.microrel.2020.113647.

I. Khalilullah et al., "In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging," 18th Int Conf Therm,Mech Multi-Phy Sim Exp Microelect Mi-crosyst (EuroSimE), pp. 1-9, https://doi: 10.1109/EuroSimE.2017.7926275.

A. Haleh & G. P. Micheal, “Chapter 5 - Encapsula-tion Defects and Failures,” in Encapsulation Technologies for Electronic Applications, 1st ed., A. Haleh & G. P. Micheal, Ed. William Andrew Publishing, 2019, pp. 225-285, https://doi.org/10.1016/B978-0-8155-1576-0.50009-7.




DOI: https://doi.org/10.33180/InfMIDEM2021.406

Refbacks

  • There are currently no refbacks.


Copyright (c) 2021 Syed Mohamad Mardzukey Syed Mohamed Zain, Azman Jalar, Maria Abu Bakar, Fakhrozi Che Ani, Mohamad Riduwan Ramli

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.