PPC-based wafer-level temporary bonding/ debonding triggered by microwave

Abstract

This paper addresses the issues that are prone to occur in the process of thinning and polishing ultra-thin wafers, such as deformation, fragmentation, damage, etc. A study was conducted on a photoacid generator (PAG) and graphite powder (C) as a load for polypropylene carbonate (PPC), utilizing microwave heating for bonding layers to achieve a rapid, efficient, and convenient temporary bonding solution. For the (PPC+PAG+C) bonding structure, the highest average shear strength reached 5.1 MPa. During the debonding process, microwave heating of the graphite powder transfers heat to the bonding layer, causing the acid generator within the bonding layer to decompose at a lower temperature, facilitating rapid and convenient debonding.