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Home > Archives > Vol 53, No 4 (2023)

Table of Contents

Electronics

Informacije MIDEM Vol. 53, No. 4, 2023 Impresum, Impresum

PDF 0-0

PPC-based wafer-level temporary bonding/ debonding triggered by microwave zhiyuan zhu

PDF 225-231

Communications

Virtual Reference Tag Assisted Radio Frequency Identification Localization And Tracking Using Artificial Intellect Techniques In Indoor Environment Mathavan Nagaraj, Siva Ranjani Seenivasan

PDF 207-233

Centimeter positioning accuracy in modern wireless cellular networks – wish or reality? Boštjan Batagelj

PDF 239-248

Technologies and Materials

Linear Thermal Expansion of 0.5Ba(Zr0.2Ti0.8)O3-0.5(Ba0.7Ca0.3)TiO3 Bulk Ceramic Sabi William Konsago, Andrej Debevec, Jena Cilenšek, Brigita Kmet, Barbara Malič

PDF 233-238